Manufacturing

Our SMT manufacturing facility consists of three fully automatic SMT high capacity lines, the newest of which is from 2011. We are able to handle the latest and most complex SMD components (from size 01005 up to 200×110), and we are distinguished by a very short setup time and flexibility, which benefits your economy.

Subsequently, SMD components are soldered in our reflow-oven using nitrogen in order to reduce the oxygen level in the oven. This in turn reduces the surface oxidation of the PCB and components. The result is better flowing of the solder and improved solderability of component terminals. We offer RoHS as well as non-RoHS manufacturing.

In our THT (THT= Through Hole Technology) manufacturing facility we mount all types of leaded components. We have extensive experience with selective soldering of printed circuit boards, using special equipment and solder frames for our nitrogen-wave soldering machine.

We guarantee acceptance standards up to class IPC A 610, regardless of whether the products are manufactured using hand or wave soldering processes.

With our two machines for automatic optical inspection (AOI) of printed circuit board assemblies and soldered printed circuit boards, we ensure a high, uniform quality of your printed circuit boards at an early stage in the process.

Electrostatic Discharge Prevention

Preventing electrostatic discharge (ESD) is paramount to the quality of the delivered products. We have procedures in place focusing on:

– Eliminating static charges from workplaces.

– Properly shielding components and assemblies from static fields.

At Danchell, all component/PCB handling areas are ESD protected, including work clothing, workbenches, flooring, storage and handling. All employees in the production areas wear special shoes or heel grounders, which are ESD approved.