SMT assembly

Our SMT manufacturing facility consists of three fully automatic SMT high capacity lines. We are able to handle the latest and most complex SMD component (from size 01005 to 200×110). We offer RoHS as well as non-RoHS manufacturing.

A quick glance at our capabilities within SMT Assembly:

  • Inhouse design of pasta stencils
  • Single or multi level stencils
  • Automatic assembly
  • Flip Chip with underfill
  • Component sizes from 01005 to 200×110 mm
  • BGA/QFP > 55×45 mm
  • BGA underfill
  • PIP – Pin in Paste (for example of connectors)
  • POP (Package on Package).
  • Shield assembly; single and double sided
  • Bonding of SMD components
  • Reflow soldering in protected atmosphere (nitrogen)
  • State of Art X-Ray inspection.
  • Automatic, optical inspection (AOI)
  • Manual soldering inspection
  • Hand soldering incl. preheating of PCB
  • BGA/QFN/LGA Rework.
  • Traceability at component level (optional)